{"site":"pcbassemblywork","cluster":"industrial-manufacturing","dataset":"pharos-master-us-2026-10-17-r1","updated_at":"2026-10-19","subjects":["missing-components","reversed-or-misoriented-components","solder-bridges","insufficient-solder-joints","failed-electrical-continuity-tests"],"contexts":["pcbassemblywork-initial-record-review","pcbassemblywork-condition-observations","pcbassemblywork-document-comparison","pcbassemblywork-qualified-review-and-handoff"],"variables":["pcbassemblywork-item-or-subject-identity","pcbassemblywork-location-and-time","pcbassemblywork-observations-and-supporting-records","pcbassemblywork-applicable-instructions-and-acceptance-criteria"],"intents":["identify","compare","specification","maintenance","verification"],"languages":["en","es","zh","fr","de","pt","ar","hi","ja","ko"],"localized_labels":{"en":{"missing-components":"missing components","reversed-or-misoriented-components":"reversed or misoriented components","solder-bridges":"solder 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imprimés: Comparaison documentaire","pcbassemblywork-qualified-review-and-handoff":"Assemblage de cartes de circuits imprimés: Examen qualifié et transmission","pcbassemblywork-item-or-subject-identity":"Assemblage de cartes de circuits imprimés: Identité de l'élément ou du sujet","pcbassemblywork-location-and-time":"Assemblage de cartes de circuits imprimés: Lieu et date","pcbassemblywork-observations-and-supporting-records":"Assemblage de cartes de circuits imprimés: Observations et pièces justificatives","pcbassemblywork-applicable-instructions-and-acceptance-criteria":"Assemblage de cartes de circuits imprimés: Instructions et critères d'acceptation applicables","identify":"Identifier","compare":"Comparer","specification":"Spécification","maintenance":"Maintenance","verification":"Vérification"},"de":{"missing-components":"Fehlende Bauteile","reversed-or-misoriented-components":"Verpolte oder falsch ausgerichtete Bauteile","solder-bridges":"Lötbrücken","insufficient-solder-joints":"Lötstellen mit zu wenig Lot","failed-electrical-continuity-tests":"Fehlgeschlagene elektrische Durchgangsprüfungen","pcbassemblywork-initial-record-review":"Leiterplattenbestückung: Erste Unterlagenprüfung","pcbassemblywork-condition-observations":"Leiterplattenbestückung: Zustandsbeobachtungen","pcbassemblywork-document-comparison":"Leiterplattenbestückung: Dokumentenvergleich","pcbassemblywork-qualified-review-and-handoff":"Leiterplattenbestückung: Qualifizierte Prüfung und Übergabe","pcbassemblywork-item-or-subject-identity":"Leiterplattenbestückung: Identität des Gegenstands oder Subjekts","pcbassemblywork-location-and-time":"Leiterplattenbestückung: Ort und Zeitpunkt","pcbassemblywork-observations-and-supporting-records":"Leiterplattenbestückung: Beobachtungen und Nachweise","pcbassemblywork-applicable-instructions-and-acceptance-criteria":"Leiterplattenbestückung: Geltende Anweisungen und Annahmekriterien","identify":"Bestimmen","compare":"Vergleichen","specification":"Spezifikation","maintenance":"Wartung","verification":"Überprüfung"},"pt":{"missing-components":"Componentes ausentes","reversed-or-misoriented-components":"Componentes invertidos ou com orientação incorreta","solder-bridges":"Pontes de solda","insufficient-solder-joints":"Juntas com solda insuficiente","failed-electrical-continuity-tests":"Falhas nos testes de continuidade elétrica","pcbassemblywork-initial-record-review":"Montagem de placas de circuito impresso: Análise inicial dos registros","pcbassemblywork-condition-observations":"Montagem de placas de circuito impresso: Observações da condição","pcbassemblywork-document-comparison":"Montagem de placas de circuito impresso: Comparação documental","pcbassemblywork-qualified-review-and-handoff":"Montagem de placas de circuito impresso: Análise qualificada e passagem de informações","pcbassemblywork-item-or-subject-identity":"Montagem de placas de 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